IBM, AMD, Sony boost chip speeds by 24%
By Tony Smith
Published Monday 13th December 2004 10:43 GMT
http://www.theregister.co.uk/2004/1...d_silicon/
IBM and AMD have found a way to improve transistor performance by up
to 24 per cent - without increasing the power draw - using a tweaked
implementation of Big Blue's 'strained silicon' process.
The process is not only going to be applied to upcoming AMD64 and
PowerPC chips, but is likely to underpin the production of Sony's
'Cell' CPU and future Macintosh computers.
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The new technique is called 'dual stress liner' (DSL) and works by not
only stretching the silicon lattice in n-type transistors, the usual
target of the strained silicon process, but by compressing the lattice
in p-type transistors. The latter transport positive charges called
'holes'; n-type transistors operate by moving negatively charged
electrons. Straining the lattice makes it easier for electrons to
flow. Essentially it's like running through an evenly planted forest -
the further apart the trees (the lattice) are, the less likely you
(the electron) are to run into one.
Bizarrely, pushing the lattice closer together, while hindering
electrons, nevertheless makes its easier for holes to move. Holes are
the spaces electrons may occupy, but they can essentially be
considered as positively charged particles. In an electric field, they
drift along like electrons do, but in the opposite direction.
Restricting electron flow, increases the number of places in which
they could be located, which is to all intents and purposes the same
thing as increasing positive particle flow.
HOT gets hotter
Building on IBM's Strained Silicon Directly on Insulator (SSDOI)
technology, DSL likewise uses Germanium to stretch the silicon lattice
then removes it before actual chip production takes place, ensuring
that its fabrication process doesn't need to be modified to take into
account the properties of the straining material. That contrasts with
Intel's strained silicon system, in which the Germanium atoms are
retained in the chip. It also makes Intel's approach more expensive to
do than IBM's.
When IBM announced SSDOI, it also announced a process called Hybrid
Orientation Technique (HOT), which improves the mobility of positive
charges, or 'holes', in the other direction by combining two
substrates on the same wafer, each with different surface
orientations.
Together SSDOI and HOT sound an awful lot like DSL. When IBM announced
its SSDOI and HOT, in September 2003, it claimed a 40-65 per cent
improvement to transistors performance over chips fabbed using a
vanilla CMOS process. At this stage, it's not clear whether the 24 per
cent gain IBM and AMD are claiming today is in addition to whatever
boost SSDOI and HOT ultimately yielded or includes that benefit.
AMD's current 90nm processor line-up already incorporate strained
silicon technology, believed to have been supplied by IBM through the
two chip makers' January 2003 R&D alliance, although that's primarily
centred on developing a joint 65nm process. AMD originally used an
alternative approach, from AmberWave, but ultimately rejected it in
favour of Big Blue's technology.
DSL is clearly a development of the basic work put in by IBM.
Interestingly, it's not only AMD that has had some input into the new
process, but Sony and Toshiba too. So DSL will almost certainly have a
role to play in the production of 'Cell', the multi-processing
oriented CPU being developed by Sony, IBM and Toshiba.
For its part, AMD said it intends to roll out 90nm processors using
the new technique during H1 2005, bringing the technique to the
production of all its 90nm parts over time. Its future dual-core chips
will utilise DSL, it said.
IBM will ship a variety of 90nm Power and PowerPC chips using the
technique in the H1 2005 timeframe, too. That may prove good news for
Mac users keen to see not only faster G5-class desktops but PowerBook
notebooks based on the 64-bit chip.
DSL will be discussed in detail at the 2004 IEEE International
Electron Devices Meeting in San Francisco this week. ®
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